This week, these five stocks have the worst ratings in Sales Growth, one of the eight Fundamental Categories on Portfolio Grader.
Navidea Biopharmaceuticals, Inc. () is focused on the development and commercialization of precision radiopharmaceutical diagnostics for diseases such as cancer. NAVB also gets F’s in Equity and Cash Flow. Shares of the stock have declined 37.9% since January 1. .
Top 10 Forestry Stocks To Invest In 2015: Advanced Photonix Inc (API)
Advanced Photonix, Inc. (API), incorporated in June 22, 1988, is engaged in the development and manufacture of optoelectronic devices and value-added sub-systems and systems. The Company serves a variety of global original equipment manufacturers (OEMs) in a variety of industries. API supports its customers from the initial concept and design phase of the product, through testing to full-scale production. API has two manufacturing facilities located in Camarillo, California and Ann Arbor, Michigan. API is a supplier of optoelectronic semiconductors packaged into high-speed optical receivers, custom optoelectronic subsystems and Terahertz instrumentation, serving a variety of global OEM markets. API supports the customer from the initial concept and design of the semiconductor, hybridization of support electronics, packaging and signal conditioning or processing from prototype through full-scale production and validation testing. The target markets served by it are industrial sensing/NDT, military/aerospace, telecom, medical and homeland security. On March 1, 2013, it acquired certain assets of Silonex, Inc.
The Company�� high-speed optical receivers include avalanche photodiode (APD) technology and positive-intrinsic-negative (PIN) photodiode technology based upon III-V materials, including InP, InAlAs, and GaAs. Its optoelectronic subsystems are based on its silicon large area avalanche photodiode (LAAPD), PIN photodiode, FILTRODE detectors and light emitting diode (LED) assemblies. API�� Terahertz sensor product line is targeted at the industrial homeland security and military markets. Using its fiber coupled technology and high speed Terahertz generation and detection sensors, the Company is engaged in transferring Terahertz technology from the laboratory to the factory floor for use in non-destructive testing and real time quality control.
The Company competes with First Sensor, Illinois Tool Works, JDS Uniphase, Neophotonix, U2T and Nippon Electric.
Advisors' Opinion:- [By Monica Gerson]
Advanced Photonix (NYSE: API) is expected to post a Q4 loss at $0.01 per share on revenue of $7.04 million.
Sport Chalet (NASDAQ: SPCHB) is projected to post its quarterly earnings.
- [By Bryan Murphy]
When most investors think of optical sensor makers, they tend to think of larger names like Honeywell International Inc.� (NYSE:HON) or Vishay Intertechnology (NYSE:VSH). And well they should. VSH is a $2 billion company, and HON is a $71.5 billion organization. The fact is, however, there are a few small cap stocks in the optical sensor space that are worth a look, and one of them is worth a very close look right now for a very clear reason... Advanced Photonix, Inc. (NYSEMKT:API).
Top 10 Semiconductor Stocks To Invest In 2014: Sunedison Inc (SUNE)
SunEdison Inc, formerly MEMC Electronic Materials, Inc., incorporated on October 1, 1984, is engaged in the development, manufacture and sale of silicon wafers. The Company is a developer and seller of photovoltaic energy solutions. Through Solar Materials and Solar Energy (SunEdison), it is a developer of solar energy projects. The Company operates in two segments: semiconductor materials and solar energy. The Company�� Solar Energy segment includes the operations of its old Solar Materials segment, as well as its SunEdison business. In the Semiconductor Materials, the Company offers wafers with a variety of features. The Company�� wafers vary in size, surface features, composition, purity levels, crystal properties and electrical properties.
Semiconductor Materials
The Company�� monocrystalline wafers for use in semiconductor applications range in size from 100 millimeter to 300 millimeter and are round in shape for semiconductor customers because of the nature of their processing equipment. Its wafers are used as the starting material for the manufacture of various types of semiconductor devices, including microprocessor, memory, logic and power devices. In turn, these semiconductor devices are used in computers, cellular phones and other mobile electronic devices, automobiles and other consumer and industrial products. Its monocrystalline wafers for semiconductor applications include four general categories of wafers: prime, epitaxial, test/monitor and silicon-on-insulator (SOI) wafers.
The Company�� prime wafer is a polished, pure wafer with an ultraflat and ultraclean surface. The Company�� epitaxial (epi), wafers consist of a thin silicon layer grown on the polished surface of the wafer. Typically, the epitaxial layer has different electrical properties from the underlying wafer. This provides customers with isolation between circuit elements than a polished wafer. Its AEGIS product is designed for certain specialized applications requiring high resis! tivity epitaxial wafers and its MDZ product feature. The AEGIS wafer includes a thin epitaxial layer grown on a standard starting wafer. The AEGIS wafer�� thin epitaxial layer eliminates harmful defects on the surface of the wafer, thereby allowing device manufacturers to increase yields. The Company supplies test/monitor wafers to its customers for use in testing semiconductor fabrication lines and processes. An SOI wafer is a different starting material for the chip making process.
Solar Energy
The Company�� Solar Energy segment provides solar energy services that integrate the design, installation, financing, monitoring, operations and maintenance portions of the downstream solar market to provide a solar energy service to its customers. As of December 31, 2012, SunEdison interconnected over 675 solar power systems representing 989 megawatt of solar energy generating capacity. As of December 31, 2012, SunEdison had 73 megawatt of projects under construction and 2.6 gigawatts in pipeline. In support of its downstream solar business, its Solar Energy segment manufactures polysilicon, silicon wafers and solar modules. Additionally, its Solar Energy segment will sell solar modules to third parties in the event the opportunity aligns with itsinternal needs. It provides its downstream customers with a way to purchase renewable energy by delivering solar power under long-term power purchase arrangements with customers or feed-in tariff arrangements with government entities and utilities. Its SunEdison business is dependent upon government subsidies, including United States federal incentive tax credits, state-sponsored energy credits and foreign feed-in tariffs. The Company�� solar wafers are used as the starting material for crystalline solar cells.
The Company competes with Shin-Etsu Handotai, SUMCO, Siltronic and LG Siltron, SunPower Corporation, First Solar, Inc., Enerparc, Sharp Corporation (Recurrent Energy), Phoenix Solar, BELECTRIC, JUWI Solar Gmbh, and S! olar City! .
Advisors' Opinion:- [By Richard Stavros]
Although these developments bode well for the sector, there is still concern that it is overvalued. First Solar Inc (NSDQ: FSLR), SunEdison Inc (NYSE: SUNE), and even electric car company Tesla Motors Inc (NSDQ: TSLA), to name a few, have seen stellar appreciation in their stock values.
- [By Claudia Assis]
SunEdison (SUNE) �said Monday it closed on a $155 billion debt financing agreement with investors that included CorpBanca, a major Chilean bank, and the Inter-American Development Bank to build a 72.8 megawatt plant in the Antofagasta region of Chile.
- [By Travis Hoium]
MEMC Electronic Materials (NYSE: SUNE ) is also transitioning from a solar supplier to a project builder, adding competition to the business. MEMC also has a larger 2.7 GW pipeline, although it doesn't have the same history in utility-scale projects as First Solar.
- [By Lauren Pollock]
SunEdison Inc.(SUNE) said Monday it will move its semiconductor crystal operations out of the U.S. and close its polysilicon manufacturing facility in Merano, Italy, which will affect more than 300 employees.
Top 10 Semiconductor Stocks To Invest In 2014: Micropac Industries Inc (MPAD)
Micropac Industries, Inc. (Micropac), incorporated on March 3, 1969, manufactures and distributes various types of hybrid microelectronic circuits, solid state relays, power operational amplifiers, and optoelectronic components and assemblies. Micropac�� products are used as components in a range of military, space and industrial systems, including aircraft instrumentation and navigation systems, power supplies, electronic controls, computers, medical devices, and high-temperature (200o degree Celsius) products. The Company�� products are either custom (being application-specific circuits designed and manufactured to meet the particular requirements of a single customer) or standard components. During the fiscal year ended December 31, 2011 (fiscal 2011), its custom-designed components accounted for approximately 34% of its revenue and standard components accounted for approximately 66% of its revenue.
Micropac occupies approximately 36,000 square feet of manufacturing, engineering and office space in Garland, Texas. The Company owns 31,200 square feet of that space and leases an additional 4,800 square feet. It also sub-contracts some manufacturing to Inmobiliaria San Jose De Ciuddad Juarez S.A. DE C.V, a maquila contract manufacturer in Juarez, Mexico.
Micropac provides microelectronic and optoelectronic components and assemblies along with contract electronic manufacturing services, and offers a range of products sold to the industrial, medical, military, aerospace and space markets. The Microcircuits product line includes custom microcircuits, solid state relays, power operational amplifiers, and regulators. During fiscal 2011, microcircuits product line accounted for 51% of its revenue and the optoelectronics product line accounted for 62% of its business respectively. The Company�� core technology is the packaging and interconnects of miniature electronic components, utilizing thick film and thin film substrates, forming microelectronics circuits. Other technologi! es include light emitting and light sensitive materials and products, including light emitting diodes and silicon phototransistors used in its optoelectronic components, and assemblies.
The Company�� basic products and technologies include custom design hybrid microelectronic circuits, solid state relays and power controllers, custom optoelectronic assemblies and components, optocouplers, light-emitting diodes, Hall-Effect devices, displays, power operational amplifiers, fiber optic components and assemblies, and high temperature (200o degree Celsius) products. Micropac�� products are primarily sold to original equipment manufacturers (OEM��) who serve major markets, which includes military/aerospace, such as aircraft instrumentation, guidance and navigations systems, control circuitry, power supplies and laser positioning; space, which include control circuitry, power monitoring and sensing, and industrial, which includes power control equipment and robotics.
The Company�� products are marketed throughout the United States and in Western Europe. During fiscal 2011, approximately 21% of the Company�� revenue was from international customers. The Company�� major customers include contractors to the United States Government. During fiscal 2010, sales to these customers for the Department of Defense (DOD) and National Aeronautics and Space Administration (NASA) contracts accounted for approximately 62% of its revenues. The Company�� customers are Lockheed Martin, Northrop Grumman, Boeing, Rockwell Int��, and NASA.
The Company compete with Teledyne Industries, Inc., MS Kennedy, Honeywell, Avago and International Rectifier.
Advisors' Opinion:- [By Geoff Gannon] strong>ADDvantage Technologies (AEY)
路 Solitron Devices (SODI)
路 OPT-Sciences (OPST)
Micropac
Micropac is 76% owned by Heinz-Werner Hempel. He�� a German businessman. You can see the German company he founded here. He�� had control of Micropac for a long-time. I don�� have an exact number in front of me. But I would guess it�� been something like 25 years.
ADDvantage
ADDvantage Technologies is controlled by the Chymiak brothers. See the company�� April 4 press release explaining their decision to turn over the CEO position to an outsider. Regardless, the Chymiaks still control 47% of the company. Ken Chymiak is now chairman. And David Chymiak is still a director and now the company�� chief technology officer. Clearly, it�� still their company.
By the way, the name ADDvantage Technologies has nothing to do with the Chymiaks. Today�� AEY really traces its roots to a private company called Tulsat. The Chymiak brothers acquired that company about 27 years ago. So, effectively, when you buy shares of AEY you are buying into a 27-year-old family-controlled company.
That�� pretty typical in the world of net-nets.
Solitron
Solitron Devices is 29% owned by Shevach Saraf. He has been the CEO for 20 years. The post-bankruptcy Solitron has never known another CEO. Before the bankruptcy, Solitron was a much bigger, much different company. So even though we are not talking about the founder here ��and even though 70% of the company�� shares are not held by the CEO ��we��e still talking about a company where one person has a lot of control. Solitron only has three directors. Saraf is the chairman, CEO, president, CFO and treasurer. Neither of the other two directors joined the board within the last 15 years. So, we aren�� talking about a lot of tumult at the top.
In fact, profitable net-nets seem to be especially common candidates for abandoning the responsibilities of a public comp
- [By Geoff Gannon] % of NCAV, has similar (slightly better) z- and f-scores, a FCF margin of 6%, but has ROA of 28%.
ADDvantage (AEY) sells at 95% of NCAV, has similar (in the ballpark) scores and FCF and ROA of 23%.The slightly better businesses are currently more expensive in terms of price/NCAV. They have less asset-based downside protection, but they are better businesses.
How do you quantify and qualify what is cheap enough? To me, there's a big difference in relative cheapness in a company selling at 74% of NCAV versus one selling at 95%. I'm wondering if I'm putting too much weight on this cheapness measurement instead of acknowledging that any decent business selling at less than NCAV is cheap enough. Yet, one has to have some quantifiable idea of when something is not cheap enough anymore.
Can you help me put this into a unified framework?
Dan
There�� a great post over at Oddball Stocks called: �� Stock is a Business�� Read it. Then go over to Richard Beddard�� Interactive Investor Blog. Bookmark that blog. Read it religiously. He looks at Ben Graham type stocks in the U.K. And he looks at them not just as stocks but as pieces of a business.
Here�� what Richard said in a post called ��iving Up on Mastery of the Universe��
I need to know:
1. Whether the managers have made good decisions in the past, and whether their incentives work in the interests of the owners, because those kind of managers often add value to a company.
2. The products a company sells will still be in demand for years to come, because if they��e not then the past, which we know, does not tell us anything about the future, which we don��.
3. A company is financially strong enough to withstand the kinds of shocks companies typically experience bearing in mind some are more sensitive to events than others.
4. How to judge whether the share price undervalues the company, bearing in mind the preceding three factors.
Top 10 Semiconductor Stocks To Invest In 2014: Advanced Semiconductor Engineering Inc (ASX)
Advanced Semiconductor Engineering, Inc. is principally engaged in the manufacture, assembly, processing, testing and distribution of integrated circuits (ICs). The Company provides semiconductor packaging and testing services, including plastic leaded chip carriers (PLCCs), quad flat packages (QFPs) and flip chip packaging technology, among others, which are applied in the manufacture of household electrical appliances, communication devices, automobile components, personal computers, set top boxes, servers, memory integrated circuits (ICs), mobile phones, digital cameras, game consoles, projectors, high definition (HD) televisions, wireless communication network products and power management ICs, among others. The Company operates its businesses primarily in Taiwan, Europe and the Americas. In August 2010, the Company acquired a 100% interest in EEMS Test Singapore.
The Company is focused on packaging and testing logic semiconductors. The Company offers its customers turnkey services, which consist of packaging, testing and direct shipment of semiconductors to end users designated by its customers. The Company�� global base of over 200 customers includes semiconductor companies across a range of end use applications, including Altera Corporation, ATI Technologies, Inc., Broadcom Corporation, Cambridge Silicon Radio Limited and Microsoft Corporation. During the year ended December 31, 2008, the Company�� packaging revenues accounted for 77.7% of its net revenues and its testing revenues accounted for 20.1% of its net revenues.
Packaging Services
The Company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the Company focuses on the packaging of semiconductors. These include advanced leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier and quad flat no-lead package, and package types based on substrates, such a! s flip-chip ball grid array (BGA) and other BGA types, as well as other packages, such as wafer-bumping products. Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. The Company�� leadframe-based packages include quad flat package (QFP)/ thin quad flat package (TQFP), quad flat no-lead package (QFN)/microchip carrier (MCC), advanced quad flat no-lead package (AQFN), bump chip carrier (BCC), small outline plastic package (SOP)/thin small outline plastic package (TSOP), small outline plastic j-bend package (SOJ), plastic leaded chip carrier (PLCC) and plastic dual in-line package (PDIP). Substrate-based packages employ the BGA design, which utilizes a substrate rather than a leadframe. It also assembles system-in-a-package products, which involve the integration of more than one chip into the same package. The Company�� substrate-based packages include Plastic BGA, Cavity Down BGA, Stacked-Die BGA, Flip-Chip BGA and land grid array (LGA).
The Company�� wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP). The Company offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable functionality, typically using surface mount technology (SMT) machines and other machinery and equipment for system-level assembly. End use applications for modules include cellular phones, personal digital assistant (PDAs), wireless local area network (LAN) applications, bluetooth applications, camera modules, automotive applications and toys.
The Company provides module assembly services primarily at its facilities in Korea for radio frequency and power amplifier modules used in wireless communications and automotive applications. Interconnect materials connect the input/output on the semiconductor dies to the printed circuit board. Interconnect materials include substrate, which is a multi-layer m! iniature ! printed circuit board. The Company produces substrates for use in its packaging operations.
Testing Services
The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/radio frequency (RF) and memory semiconductors and other test-related services. The Company provides front-end engineering testing services, including customized software development, electrical design validation, and reliability and failure analysis. The Company provides final testing services for a variety of memory products, such as static random access memory (SRAM), dynamic random access memory (DRAM), single-bit erasable programmable read-only memory semiconductors and flash memory semiconductors.
The Company provides a range of additional test-related services, including burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The Company offers drop shipment services for shipment of semiconductors directly to end users designated by its customers.
Advisors' Opinion:- [By Adam Haigh]
ASX Ltd. (ASX) posted the biggest weekly loss in 3 1/2 years, falling 6.1 percent to A$33.15, amid a A$553 million ($530 million) capital raising at the operator of Australia�� main stock exchange to ensure its clearing business complies with new regulations.
- [By Jeff Reeves]
Advanced Semiconductor Engineering�(ASX) builds and distributes integrated circuits and other electronics. It�� not as sexy as some mobile chipmakers, but thankfully it doesn�� have to be — ASX is simply capitalizing on the general demand for microchips in everything from cars to computers to TVs.
Top 10 Semiconductor Stocks To Invest In 2014: NextStage Inc (NXT)
NextStage, Inc. is a holding company. The Company is engaged in the management of its investments in shares of stocks of its subsidiaries. The Company�� subsidiaries include Mondex Philippines Inc. (MXP), Infinit-e Asia Inc. (Infinit-e Asia) and Technology Support Services, Inc. (TSSI). MXP operates a multi-application smart card system in Philippines. Infinit-e Asia is a software development company specializing on smart card and e-commerce solutions tailored to enhance the business of its clients. Infinit-e Asia develops smart card solutions for both real and online applications and on both contact and contactless platform. Infinit-e Asia�� spectrum of products and applications are classified as payments, data capture and security. TSSI is engaged in the business of business process outsourcing (BPO), applications service providers (ASP) and managed service providers (MSP). Advisors' Opinion:- [By Namitha Jagadeesh]
HSBC Holdings Plc (HSBA), Europe�� largest bank, slid 2.1 percent. International Consolidated Airlines Group SA (IAG) declined 2 percent as it canceled some of its flights following a disruption caused by one of its planes at Heathrow airport. Next Plc (NXT) retreated 2.4 percent as Morgan Stanley cut its recommendation on the shares.
Top 10 Semiconductor Stocks To Invest In 2014: Advantest Corp (ATE)
Advantest Corporation, incorporated in December 1954, is a part of Advantest group. The Company operates in three segments: semiconductor and component test system segment; mechatronics system segment, focusing on peripheral devices including test handlers and device interfaces, and services, support and others segment. The semiconductor and component test system segment provides customers with test system products for the semiconductor industry and the electronic component industry. The mechatronics system segment focuses on peripheral devices to the semiconductor and component test systems. The services, support and others segment consists of comprehensive customer solutions provided in connection with the semiconductor and component test system and mechatronics system segments, support services and an equipment lease business.
Semiconductor and Component Test Systems Segment
Semiconductor and component test systems are used during the semiconductor and electronic component manufacturing process to confirm that a semiconductor functions properly. Semiconductor and component test systems consist of test systems for memory semiconductors and test systems for non memory semiconductors. Advantest�� test systems for memory semiconductors are test systems designed to test high-speed/high performance dynamic random access memory (DRAM) semiconductors used in equipment such as personal computers and servers, as well as flash memory semiconductors used in digital consumer products.
Test systems for memory semiconductors consist of a mainframe and one or more test heads. During testing, a device interface is attached to the test head. During the front-end testing process, wafers are loaded by a prober and are connected to the test system for memory semiconductors through the device interface. Electric signals between the die and the test systems for memory semiconductors are transmitted through probe pins located in the device interface and tested. After front-end te! sting is completed, the wafer is diced into separate dies and properly functioning dies are packaged. During back-end testing, test handlers are used to load these packaged devices onto the test heads, and electric signals are transmitted between the devices and the test heads via the device interface and tested. The test results are analyzed by the test systems for memory semiconductors��hardware circuits and software programs. Customized software programs for each semiconductor are required to analyze the semiconductor tests and test data.
Advantest�� main product lines of test systems for memory semiconductors are the T5500 series, the T5300 series and the T5700 series. The T5593 is a test system targeted at the market for high speed memory semiconductors, such as DDR2- Synchronous Dynamic Random Access Memory (SDRAM) and Synchronous Graphics Random Access Memory (SGRAM). The T5383 is a multi-functional test system for memory semiconductors that reduces testing costs for semiconductor manufacturers. Advantest�� main line of test systems for non memory semiconductors relates to test systems for SoC semiconductors, test systems for liquid crystal display (LCD) driver integrated circuits and test systems for semiconductors used in car electronics. The T6577 test systems for SoC semiconductors in the T6500 series were primarily developed to test micro controller unit (MCU) and SoC semiconductors that control digital consumer products at the production lines. The T6300 series are test systems for LCD driver integrated circuits used with high-definition LCD displays. The T7721, T7722 and T7723 are test systems for non memory semiconductors for mixed signal integrated circuits. The T8571A is a test system for non memory semiconductors that is primarily used to evaluate and analyze CCDs which are image sensors.
Mechatronics System Segment
The Main products in the Mechatronics System Segment are test handlers which handle semiconductor devices and automate the te! sting, an! d device interfaces which are the interfaces with devices being tested. Test handlers are used with semiconductor and component test systems to handle, condition temperature, contact and sort semiconductors and other electronic components during the back-end testing of the semiconductor manufacturing process. Advantest�� test handlers are sold primarily in conjunction with the sale of its semiconductor and component test systems. The M6242 test handler for test systems for memory semiconductors, including DDR-3SDRAM, can handle up to 512 semiconductors at a time. Advantest�� test handlers for non memory semiconductors, including SoC semiconductors, are the M4841, the M4741A and the M4742A, among others.
Advantest develops and manufactures device interfaces for semiconductor and component test systems and supplies device interfaces, such as high performance and high density connectors, socket boards and sockets. For test systems for memory semiconductors, Advantest provides motherboards capable of handling a maximum of 512 semiconductors at a time. For test systems for non memory semiconductors, Advantest provides motherboards that are compatible with a maximum of 3,072 signals. Advantest also provides motherboards designed for use in front-end testing. Advantest provides custom manufacturing of socket boards and performance boards for each device under test in accordance with customers��specifications.
Advantest provides sockets for test systems for memory semiconductors. Advantest provides low-inductance (0.4nH) sockets and fine pitch (0.4mm) sockets for semiconductors that are becoming more high-speed and more compact in size. Advantest provides carrying and contacting mechanism components compatible with each device under test for test handlers for memory semiconductors and test handlers for non memory semiconductors.
Services, Support and Others Segment
In the services, support and others segment, Advantest has focused on maintenance serv! ices, suc! h as installation and repair of Advantest�� products. It also focused on lease and rental services of its products as a part of Advantest�� effort to provide customers with comprehensive solutions.
The Company competes with Teradyne, Inc., Verigy Ltd., LTX-Credence Corporation, Yokogawa Electronic Corporation, FROM30 CO., LTD., EXICON Ltd., UniTest Inc., Delta Design, Inc., Seiko Epson Corporation, Mirae Corporation, TechWing, Inc., TSE Co., Ltd. and Secron Co., Ltd.
Advisors' Opinion:- [By Dan Carroll]
Nissan's done better this year than electronics maker Advantest (NYSE: ATE ) , but this stock absolutely blew up over the past week. Advantest's shares shot higher by more than 9%, wiping out pessimism over the company's weak earnings released a few weeks ago. Advantest's net loss and operating profit both fell below its guidance, and despite this week's investor optimism, the future's murky for this company. Financial site TheStreet downgraded the stock last week, citing Advantest's falling earnings, among other issues.
Top 10 Semiconductor Stocks To Invest In 2014: Taiwan Semiconductor Manufacturing Co Ltd (TSM)
Taiwan Semiconductor Manufacturing Co., Ltd. is a Taiwan-based company principally engaged in the research, development, manufacture and distribution of integrated circuit (IC) related products. The Company operates its businesses through wafer manufacture, mask production, wafer testing and packaging components. The Company also involves in the provision of production management, customer services and design services. Its products and services are applied in the manufacture of personal computers and peripheral products, information related products, wire and wireless communication systems, automobile and industrial equipment, as well as consumer electronic products, such as digital disk players, digital televisions (TVs), game consoles, digital cameras, among others. Its customers include Altera, AMD, Broadcom, Marvell, NVIDIA, Qualcomm, Analog Devices, Freescale, NXP and Texas Instruments, among others. In July 2010, Taiwan Semiconductor Manufacturing Co. acquired mechanical and engineering equipment from ASML HONG KONG LTD. In September 2010, the Company acquired a set of equipments from ASML HONG KONG LTD. In December 2010, the Company acquired a set of equipment from TOKYO ELECTRON LTD., KLA-TENCOR CORP. and NOVELLUS SYSTEMS INTERNATIONAL,B.V. In January 2011, the Company announced that it had acquired a set of equipment from KLA-TENCOR CORP., a set of equipment and facility, and another set of equipment from VARIAN SEMI. EQUIP. ASSOCIATES GmbH. In March 2011, the Company acquired a set of equipments from Rudolph Technologies, Inc.In March 2011, the Company acquired a set of equipments from Rudolph Technologies, Inc. In May 2011, it acquired a set of equipments form APPLIED MATERIALS SOUTH EAST ASIA PACIFIC LTD., Hamatech APE Gmbh and CO. KG, TOKYO ELECTRON LTD., DAINIPPON SCREEN MFG. CO., LTD., and VARIAN SEMI. EQUIP. ASSOCIATES GMBH.
TSMC's customers include semiconductor companies, ranging from fabless semiconductor and systems companies, such as Advanced Micro Devices, In! c., Altera Corporation, Broadcom Corporation, Marvell Semiconductor Inc., MediaTek Inc., nVidia Corporation and Qualcomm Incorporated, to integrated device manufacturers, such as LSI Corporation, STMicroelectronics and Texas Instruments Inc. Fabless semiconductor and system companies accounted for approximately 80%, and integrated device manufacturers accounted for approximately 20% of its net sales as of December 31, 2009.
The Company manufactures semiconductors using CMOS and BiCMOS processes. The BiCMOS process combines the speed of the bipolar circuitry and the power consumption and density of the CMOS circuitry. It uses the CMOS process to manufacture logic semiconductors, memory semiconductors, including static random access memory (SRAM), flash memory, mixed-signal/ radio frequency (RF) semiconductors, which combine analog and digital circuitry in a single semiconductor, micro-electro-mechanical-system (MEMS), which combines micrometer featured mechanical parts, analog and digital circuitry in a single semiconductor, and embedded memory semiconductors, which combine logic and memory in a single semiconductor. The BiCMOS process is used to make high-end mixed-signal and other types of semiconductors.
Advisors' Opinion:- [By Charles Sizemore]
For example, the iShares MSCI Emerging Markets ETF (EEM) is comprised of companies that, while domiciled in the emerging world, get a large chunk of their revenues from exporting to the West. Think Samsung (SSNLF) and Taiwan Semiconductor (TSM). (Whether South Korea and Taiwan are ��merging markets��or ��eveloped markets��is another debate for another day, but both countries are well represented in EEM.)
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